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LLDB3TGL1

Taiwan Semiconductor

Taiwan Semiconductor LLDB3TGL1
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8541.30.00.80
  • SB Code
    8541.30.00.80
  • JESD-30 Code
    O-LELF-R2
  • Configuration
    SINGLE
  • Package Shape
    ROUND
  • Package Style
    LONG FORM Meter
  • Surface Mount
    YES
  • Terminal Form
    WRAP AROUND
  • J-STD-609 Code
    e3
  • Case Connection
    ISOLATED
  • Terminal Finish
    MATTE TIN
  • Terminal Position
    END
  • Number of Elements
    1
  • Number of Terminals
    2
  • Trigger Device Type
    DIAC
  • Package Body Material
    GLASS
  • Breakover Voltage-Max (V)
    34
  • Breakover Voltage-Min (V)
    30

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LLDB3TGL1
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LLDB3TGL1