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LH2003CN

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LH2003CN
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Width
    7.62 mm
  • Length
    9.817 mm
  • Technology
    HYBRID
  • JESD-30 Code
    R-PDIP-T8
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Slew Rate-Min
    600 V/us
  • Slew Rate-Nom
    400 V/us
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Amplifier Type
    BUFFER
  • Terminal Pitch
    2.54 mm
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Seated Height-Max
    5.08 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Output Current-Min
    0.105 A
  • Supply Current-Max
    15 mA
  • Bandwidth (3dB)-Nom
    100 MHz
  • Number of Functions
    1
  • Number of Terminals
    8
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Input Offset Voltage-Max
    50000 uV
  • Package Equivalence Code
    DIP8,.3
  • Supply Voltage Limit-Max
    18 V
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Nom (Vsup)
    15 V
  • Bias Current-Max (IIB) @25C
    25 uA
  • Neg Supply Voltage Limit-Max
    -18 V
  • Neg Supply Voltage-Nom (Vsup)
    -15 V

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LH2003CN
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LH2003CN