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LH2003CJ

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LH2003CJ
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Technology
    HYBRID
  • Width (mm)
    7.62
  • Length (mm)
    10.16
  • JESD-30 Code
    R-GDIP-T8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Amplifier Type
    BUFFER
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    2.54
  • Slew Rate-Min (V/us)
    600
  • Slew Rate-Nom (V/us)
    400
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Output Current-Min (A)
    0.105
  • Seated Height-Max (mm)
    5.08
  • Supply Voltage-Nom (V)
    15
  • Supply Current-Max (mA)
    15
  • Package Equivalence Code
    DIP8,.3
  • Bandwidth (3dB)-Nom (MHz)
    100
  • Supply Voltage Limit-Max (V)
    18
  • Input Offset Voltage-Max (uV)
    50000
  • Negative Supply Voltage-Nom (V)
    -15
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25
  • Bias Current-Max (IIB) @25C (uA)
    25
  • Neg Supply Voltage Limit-Max (V)
    -18

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LH2003CJ
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LH2003CJ