Intel Corporation LE82GME965SLJ9Z
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B1299
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1299
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.73
  • Supply Voltage-Max (V)
    1.1025
  • Supply Voltage-Min (V)
    0.9975
  • Supply Voltage-Nom (V)
    1.05
  • Package Equivalence Code
    BGA1299,51X51,32
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CHIPSET, ALPHA
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    0

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LE82GME965SLJ9Z