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LE82GM965

Intel Corporation

Intel Corporation LE82GM965
  • ECCN
    4A994
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width
    35 mm
  • Length
    35 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B1299
  • Package Code
    BGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Number of Banks
    8
  • Address Bus Width
    15
  • Bus Compatibility
    ATA, I2C, ISA, LPC, PCI, SIO, SMBUS, SPI, USB
  • Seated Height-Max
    1.73 mm
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    1.1025 V
  • Supply Voltage-Min
    0.9975 V
  • Supply Voltage-Nom
    1.05 V
  • Memory Organization
    256M X 64
  • Number of Terminals
    1299
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    64
  • uPs/uCs/Peripheral ICs Type
    MEMORY CONTROLLER, DRAM

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LE82GM965
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LE82GM965