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LE82G31

Intel Corporation

Intel Corporation LE82G31
  • ECCN
    4A994
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B1226
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    0.8 mm
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    7000 mA
  • Number of Terminals
    1226
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA1226,43X43,32
  • uPs/uCs/Peripheral ICs Type
    MEMORY CONTROLLER, DRAM

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LE82G31
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LE82G31