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LE24LA162CB

SANYO Semiconductor Co., Ltd.

SANYO Semiconductor Co., Ltd. LE24LA162CB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B6
  • Memory Width
    8
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    I2C
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    2KX8
  • Number of Functions
    1
  • Number of Terminals
    6
  • Number of Words Code
    2K
  • Memory Density (bits)
    16384
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    2048
  • Clock Frequency-Max (MHz)
    0.4
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Write Cycle Time-Max (tWC) (ms)
    10

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LE24LA162CB
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LE24LA162CB