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L9D364M64SBG2I25

LOGIC DEVICES INC

LOGIC DEVICES INC L9D364M64SBG2I25
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    16
  • Access Mode
    MULTI BANK PAGE BURST
  • Length (mm)
    22
  • JESD-30 Code
    R-PBGA-B271
  • Memory Width
    64
  • Package Code
    BGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR3 DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Number of Ports
    1
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    64MX64
  • Number of Functions
    1
  • Number of Terminals
    271
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    64M
  • Memory Density (bits)
    4294967296
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.9
  • Supply Voltage-Max (V)
    1.575
  • Supply Voltage-Min (V)
    1.425
  • Supply Voltage-Nom (V)
    1.5
  • Number of Words (words)
    67108864
  • Sequential Burst Length
    4,8
  • Standby Current-Max (A)
    0.44
  • Standby Voltage-Min (V)
    1.425
  • Supply Current-Max (mA)
    440
  • Interleaved Burst Length
    4,8
  • Package Equivalence Code
    BGA271,13X21,40
  • Clock Frequency-Max (MHz)
    400
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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L9D364M64SBG2I25