L9D3256M72SBG2M125L by LOGIC DEVICES INC | Sourcengine

LOGIC DEVICES INC L9D3256M72SBG2M125L

Lifecycle status
Discontinued
REACH
REACH compliant
Description
DDR3L DRAM, 256MX72, 0.225ns, CMOS, PBGA271
Category
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PBGA-B271
Memory Width
72
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Refresh Cycles
8192
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Memory Organization
256MX72
Number of Terminals
271
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.225
Number of Words Code
256M
Memory Density (bits)
19327352832
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Supply Voltage-Nom (V)
1.35
Number of Words (words)
268435456
Standby Current-Max (A)
0.06
Supply Current-Max (mA)
1195
Package Equivalence Code
BGA271,13X21,40
Clock Frequency-Max (MHz)
800
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55