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L9D3256M32DBG2I125

LOGIC DEVICES INC

LOGIC DEVICES INC L9D3256M32DBG2I125
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B271
  • Memory Width
    64
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR DRAM MODULE
  • Refresh Cycles
    8192
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    256MX64
  • Number of Terminals
    271
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    0.225
  • Number of Words Code
    256M
  • Memory Density (bits)
    17179869184
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    1.35
  • Number of Words (words)
    268435456
  • Standby Current-Max (A)
    0.08
  • Supply Current-Max (mA)
    1140
  • Package Equivalence Code
    BGA271,13X21,40
  • Clock Frequency-Max (MHz)
    800
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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L9D3256M32DBG2I125