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L-ET1301FER1B2-M-DT

LSI CORP

L-ET1301FER1B2-M-DT Datasheet
LSI CORP L-ET1301FER1B2-M-DT
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • JESD-30 Code
    S-PQCC-N68
  • Package Code
    HQCCN
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • J-STD-609 Code
    e3
  • Terminal Finish
    Matte Tin (Sn) - with Nickel (Ni) barrier
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    2.62
  • Supply Voltage-Min (V)
    2.38
  • Supply Voltage-Nom (V)
    2.5
  • External Data Bus Width
    0
  • Clock Frequency-Max (MHz)
    25
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Data Transfer Rate-Max (MBps)
    100
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    40

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L-ET1301FER1B2-M-DT