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KU80386EX25

Intel Corporation

Intel Corporation KU80386EX25
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    24.13
  • Length (mm)
    24.13
  • RAM (words)
    0
  • Speed (MHz)
    25
  • JESD-30 Code
    S-PQFP-G132
  • Package Code
    BQFP
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, BUMPER Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Integrated Cache
    NO
  • Address Bus Width
    26
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Additional Feature
    DRAM REFRESH CONTROLLER
  • Number of Terminals
    132
  • Terminal Pitch (mm)
    0.635
  • Number of Serial I/Os
    2
  • Package Body Material
    PLASTIC/EPOXY
  • Number of DMA Channels
    2
  • On Chip Data RAM Width
    0
  • Seated Height-Max (mm)
    4.57
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    16
  • Supply Current-Max (mA)
    420
  • Package Equivalence Code
    SPQFP132,1.1SQ
  • Clock Frequency-Max (MHz)
    50
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Number of External Interrupts
    10
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    0

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KU80386EX25
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KU80386EX25