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KMM466F213CS1-L6

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. KMM466F213CS1-L6
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDMA-N144
  • Memory Width
    64
  • Organization
    2MX64
  • Package Code
    DIMM
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    134217728 bit
  • Memory IC Type
    EDO DRAM MODULE
  • Refresh Cycles
    2048
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    60 ns
  • Number of Words
    2097152 words
  • Seated Height-Max
    25.4 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    800 mA
  • Number of Terminals
    144
  • Standby Current-Max
    0.0016 Amp
  • Number of Words Code
    2M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIMM144,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    3.3 V

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KMM466F213CS1-L6
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KMM466F213CS1-L6