Freescale Semiconductor, Inc. KMC68MH360ZP33L
  • ECCN
    3A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width
    25 mm
  • Length
    25 mm
  • Technology
    HCMOS
  • JESD-30 Code
    S-PBGA-B357
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Terminal Pitch
    1.27 mm
  • Address Bus Width
    32
  • Bus Compatibility
    68000
  • Seated Height-Max
    1.86 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    5.25 V
  • Supply Voltage-Min
    4.75 V
  • Supply Voltage-Nom
    5 V
  • Clock Frequency-Max
    33.34 MHz
  • Number of Terminals
    357
  • Qualification Status
    Not Qualified
  • Number of Serial I/Os
    4
  • Package Body Material
    PLASTIC/EPOXY
  • Communication Protocol
    ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
  • Data Transfer Rate-Max
    1.25 MBps
  • External Data Bus Width
    32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, LAN
  • Data Encoding/Decoding Method
    NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
  • Peak Reflow Temperature (Cel)
    220
  • Time@Peak Reflow Temperature-Max (s)
    30

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KMC68MH360ZP33L