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KM23V8100DG-12

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. KM23V8100DG-12
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    12.6 mm
  • Length
    28.5 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    16
  • Organization
    512KX16
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    8388608 bit
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    120 ns
  • Number of Words
    524288 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    3.1 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Additional Feature
    CONFIGURABLE AS 512K X 16
  • Number of Functions
    1
  • Number of Terminals
    44
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.3 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3 V

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KM23V8100DG-12
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KM23V8100DG-12