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KM23S32000BTY

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. KM23S32000BTY
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G48
  • Memory Width
    16
  • Organization
    2MX16
  • Package Code
    TSSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    33554432 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    120 ns
  • Number of Words
    2097152 words
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    20 mA
  • Number of Terminals
    48
  • Standby Current-Max
    5.0E-6 Amp
  • Number of Words Code
    2M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Package Equivalence Code
    TSSOP48,.71,20
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Moisture Sensitivity Level
    3

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KM23S32000BTY