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KM23C4100BFP-10

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. KM23C4100BFP-10
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    10 mm
  • Length
    10 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G44
  • Memory Width
    8
  • Organization
    512KX8
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    4194304 bit
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    100 ns
  • Number of Words
    524288 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.8 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    CONFIGURABLE AS 256KX16
  • Number of Functions
    1
  • Number of Terminals
    44
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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KM23C4100BFP-10