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KM2364SP-20

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. KM2364SP-20
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    MOS
  • JESD-30 Code
    R-PDIP-T24
  • Memory Width
    8
  • Organization
    8KX8
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    65536 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    200 ns
  • Number of Words
    8192 words
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    60 mA
  • Number of Terminals
    24
  • Number of Words Code
    8K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP24,.6
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Moisture Sensitivity Level
    3

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KM2364SP-20
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KM2364SP-20