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KLMBG4WEMC-B0310

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. KLMBG4WEMC-B0310
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    MLC NAND TYPE
  • Technology
    CMOS
  • Width (mm)
    11.5
  • Length (mm)
    13
  • JESD-30 Code
    R-PBGA-B
  • Memory Width
    8
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH CARD
  • Operating Mode
    SYNCHRONOUS
  • Terminal Position
    BOTTOM
  • Memory Organization
    32GX8
  • Number of Functions
    1
  • Number of Words Code
    32G
  • Memory Density (bits)
    274877906944
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    34359738368
  • Programming Voltage (V)
    5
  • Clock Frequency-Max (MHz)
    200

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KLMBG4WEMC-B0310