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KFK8G16Q2M-DEB8

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. KFK8G16Q2M-DEB8
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Page Size
    2K words
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Sector Size
    64K Words
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B63
  • Memory Width
    16
  • Organization
    512MX16
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    8589934592 bit
  • Memory IC Type
    FLASH
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    9 ns
  • Number of Words
    536870912 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    35 mA
  • Number of Terminals
    63
  • Standby Current-Max
    0.0001 Amp
  • Number of Words Code
    512M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    8K
  • Package Equivalence Code
    BGA63,10X12,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -30 Cel
  • Supply Voltage-Nom (Vsup)
    1.8 V

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KFK8G16Q2M-DEB8