K9F6408U0C-HCB0
Samsung Semiconductor, Inc.
- Lifecycle statusContact Mfr
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionFlash, 8MX8, 35ns, PBGA48
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.51
- SB Code8542.32.00.50
- Page Size512 words
- Ready/BusyYES
- TechnologyCMOS
- Toggle BitNO
- Sector Size8K Words
- Data PollingNO
- JESD-30 CodeR-PBGA-B48
- Memory Width8
- Organization8MX8
- Package CodeFBGA
- JESD-609 Codee3
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density67108864 bit
- Memory IC TypeFLASH
- Terminal Pitch0.8 mm
- Access Time-Max35 ns
- Number of Words8388608 words
- Parallel/SerialPARALLEL
- Terminal FinishMATTE TIN
- Temperature GradeCOMMERCIAL
- Terminal PositionBOTTOM
- Supply Current-Max20 mA
- Number of Terminals48
- Standby Current-Max5.0E-5 Amp
- Number of Words Code8M
- Qualification StatusNot Qualified
- Package Body MaterialPLASTIC/EPOXY
- Command User InterfaceYES
- Number of Sectors/Size1K
- Package Equivalence CodeBGA48,6X8,32
- Operating Temperature-Max70 Cel
- Operating Temperature-Min0 Cel
- Supply Voltage-Nom (Vsup)3.3 V
- Moisture Sensitivity Level1
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K9F6408U0C-HCB0