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K9F1G08R0A-XIB00

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K9F1G08R0A-XIB00
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Technology
    CMOS
  • JESD-30 Code
    R-XUUC-N
  • Memory Width
    8
  • Organization
    128MX8
  • Package Code
    DIE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory Density
    1073741824 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Access Time-Max
    30 ns
  • Number of Words
    134217728 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    UPPER
  • Number of Functions
    1
  • Programming Voltage
    1.8 V
  • Number of Words Code
    128M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Supply Voltage-Min (Vsup)
    1.65 V
  • Supply Voltage-Nom (Vsup)
    1.8 V

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