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K9F1G08D0A-PIB0

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K9F1G08D0A-PIB0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-PDSO-G48
  • Memory Width
    8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Write Protection
    HARDWARE
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    2K
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    128MX8
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    30
  • Number of Words Code
    128M
  • Memory Density (bits)
    1073741824
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Supply Voltage-Nom (V)
    2.65
  • Number of Words (words)
    134217728
  • Standby Current-Max (A)
    5.0E-5
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    TSSOP48,.8,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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