K8P3315UQB-EE4D0
Samsung Semiconductor, Inc.
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionFlash, 2MX16, 70ns, PBGA64
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.51
- SB Code8542.32.00.50
- TypeNOR TYPE
- Boot BlockBOTTOM/TOP
- Ready/BusyYES
- TechnologyCMOS
- Toggle BitYES
- Data PollingYES
- JESD-30 CodeS-PBGA-B64
- Memory Width16
- Package CodeBGA
- Package ShapeSQUARE
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- Memory IC TypeFLASH
- Parallel/SerialPARALLEL
- DLA QualificationNot Qualified
- Page Size (words)8
- Temperature GradeOTHER
- Terminal PositionBOTTOM
- Memory Organization2MX16
- Number of Terminals64
- Sector Size (words)4K,32K
- Terminal Pitch (mm)1
- Access Time-Max (ns)70
- Number of Words Code2M
- Memory Density (bits)33554432
- Package Body MaterialPLASTIC/EPOXY
- Command User InterfaceYES
- Common Flash InterfaceYES
- Number of Sectors/Size16,62
- Number of Words (words)2097152
- Standby Current-Max (A)3.0E-5
- Supply Current-Max (mA)55
- Package Equivalence CodeBGA64,8X8,40
- Operating Temperature-Max (Cel)85
- Operating Temperature-Min (Cel)-25
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K8P3315UQB-EE4D0