K8F5715ETM-SC1F0 by Samsung Semiconductor, Inc. | Sourcengine

Samsung Semiconductor, Inc. K8F5715ETM-SC1F0

Lifecycle status
Discontinued
RoHS
RoHS compliant
REACH
REACH compliant
Description
Flash, 16MX16, 100ns, PBGA44
Category
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Width
8 mm
Length
9 mm
Boot Block
TOP
Ready/Busy
YES
Technology
CMOS
Toggle Bit
YES
Sector Size
16K,64K Words
Data Polling
YES
JESD-30 Code
R-PBGA-B44
Memory Width
16
Organization
16MX16
Package Code
VFBGA
JESD-609 Code
e1
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
268435456 bit
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS
Terminal Pitch
0.5 mm
Access Time-Max
100 ns
Number of Words
16777216 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN SILVER COPPER
Seated Height-Max
1 mm
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Supply Current-Max
55 mA
Number of Functions
1
Number of Terminals
44
Programming Voltage
1.8 V
Standby Current-Max
2.0E-5 Amp
Number of Words Code
16M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Command User Interface
YES
Common Flash Interface
YES
Number of Sectors/Size
4,255
Package Equivalence Code
BGA44,8X14,20
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Moisture Sensitivity Level
2