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K7N163631B-FI25

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K7N163631B-FI25
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    36
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    512KX36
  • Number of Terminals
    165
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    2.6
  • Number of Words Code
    512K
  • Memory Density (bits)
    18874368
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Number of Words (words)
    524288
  • Standby Current-Max (A)
    0.13
  • Standby Voltage-Min (V)
    3.14
  • Supply Current-Max (mA)
    360
  • Package Equivalence Code
    BGA165,11X15,40
  • Clock Frequency-Max (MHz)
    250
  • Moisture Sensitivity Level
    1
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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K7N163631B-FI25