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K4X1G163PC-FGC6

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K4X1G163PC-FGC6
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    16
  • Organization
    1GX16
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    17179869184 bit
  • Memory IC Type
    DDR1 DRAM
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    1
  • Number of Words
    1073741824 words
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    60
  • Number of Words Code
    1G
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260

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K4X1G163PC-FGC6