ProductsManufacturers
Events
Send an RFQBOM Tool

K4R761869A-GCM8

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K4R761869A-GCM8
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B92
  • Memory Width
    18
  • Organization
    32MX18
  • Package Code
    FBGA
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    603979776 bit
  • Memory IC Type
    RAMBUS DRAM
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    40 ns
  • Number of Words
    33554432 words
  • Terminal Finish
    TIN SILVER COPPER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    92
  • Number of Words Code
    32M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA92,10X18,32
  • Operating Temperature-Min
    0 Cel
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260

0 suppliers available to buy or to bid for K4R761869A-GCM8

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
K4R761869A-GCM8
Send an RFQ
K4R761869A-GCM8