ProductsManufacturers
Events
Send an RFQBOM Tool

K4F6E3S4HM-MGCJ0

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K4F6E3S4HM-MGCJ0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    14.5
  • JESD-30 Code
    R-PBGA-B200
  • Memory Width
    32
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    LPDDR4 DRAM
  • Operating Mode
    ASYNCHRONOUS
  • Refresh Cycles
    8192
  • Number of Ports
    1
  • Terminal Position
    BOTTOM
  • Memory Organization
    512MX32
  • Number of Functions
    1
  • Number of Terminals
    200
  • Terminal Pitch (mm)
    0.65
  • Number of Words Code
    512M
  • Memory Density (bits)
    17179869184
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Nom (V)
    1.1
  • Number of Words (words)
    536870912
  • Package Equivalence Code
    BGA200,12X22,32/25
  • Clock Frequency-Max (MHz)
    1867
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

0 suppliers available to buy or to bid for K4F6E3S4HM-MGCJ0

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
K4F6E3S4HM-MGCJ0
Send an RFQ
K4F6E3S4HM-MGCJ0