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K4F6E304HB-MGCH0

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K4F6E304HB-MGCH0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B200
  • Memory Width
    32
  • Organization
    512MX32
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    17179869184 bit
  • Memory IC Type
    DDR4 DRAM
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    1
  • Number of Words
    536870912 words
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    200
  • Number of Words Code
    512M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Nom (Vsup)
    1.8 V

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K4F6E304HB-MGCH0