Samsung Semiconductor, Inc. K4A4G165WD-BIPB0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    7.5 mm
  • Length
    13.3 mm
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B96
  • Memory Width
    16
  • Organization
    256MX16
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    4294967296 bit
  • Memory IC Type
    DDR4 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Number of Ports
    1
  • Number of Words
    268435456 words
  • Seated Height-Max
    1.2 mm
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    96
  • Number of Words Code
    256M
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (Vsup)
    1.26 V
  • Supply Voltage-Min (Vsup)
    1.14 V
  • Supply Voltage-Nom (Vsup)
    1.2 V

0 suppliers available to buy or to bid for K4A4G165WD-BIPB0

Send an RFQ

Your RFQ will be directly sent to our expert: Ayesha

Send an RFQ
K4A4G165WD-BIPB0
Send an RFQ
K4A4G165WD-BIPB0