ProductsManufacturers
Events
Send an RFQBOM Tool

K3QF1F10EM-AGCF0

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K3QF1F10EM-AGCF0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    11 mm
  • Length
    11.5 mm
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B253
  • Memory Width
    32
  • Organization
    128MX32
  • Package Code
    VFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    4294967296 bit
  • Memory IC Type
    LPDDR3 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Number of Ports
    2
  • Number of Words
    134217728 words
  • Seated Height-Max
    0.9 mm
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
  • Number of Functions
    1
  • Number of Terminals
    253
  • Number of Words Code
    128M
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (Vsup)
    1.3 V
  • Supply Voltage-Min (Vsup)
    1.14 V
  • Supply Voltage-Nom (Vsup)
    1.2 V

0 suppliers available to buy or to bid for K3QF1F10EM-AGCF0

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
K3QF1F10EM-AGCF0
Send an RFQ
K3QF1F10EM-AGCF0