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K3N3V(U)3000D-YE

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K3N3V(U)3000D-YE
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDSO-G32
  • Memory Width
    8
  • Organization
    512KX8
  • Package Code
    TSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    4194304 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    120 ns
  • Number of Words
    524288 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Supply Current-Max
    25 mA
  • Number of Terminals
    32
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Equivalence Code
    TSOP32,.8
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -20 Cel

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