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K3N3VS3000D-YC

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K3N3VS3000D-YC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDSO-G32
  • Memory Width
    8
  • Package Code
    TSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    512KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    250
  • Number of Words Code
    512K
  • Memory Density (bits)
    4194304
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    524288
  • Supply Current-Max (mA)
    15
  • Package Equivalence Code
    TSOP32,.8
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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K3N3VS3000D-YC
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K3N3VS3000D-YC