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ISP1763AETTM

ST-ERICSSON

ST-ERICSSON ISP1763AETTM
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    4
  • Length (mm)
    4
  • JESD-30 Code
    S-PBGA-B64
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    16
  • Bus Compatibility
    PCI
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    16
  • Package Equivalence Code
    BGA64,8X8,16
  • Clock Frequency-Max (MHz)
    24
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, UNIVERSAL SERIAL BUS
  • Data Transfer Rate-Max (MBps)
    60
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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ISP1763AETTM
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ISP1763AETTM