ProductsManufacturers
Events
Send an RFQBOM Tool

ISP1362EE

ST-ERICSSON

ST-ERICSSON ISP1362EE
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    6
  • Length (mm)
    6
  • JESD-30 Code
    S-PBGA-B64
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    2
  • Bus Compatibility
    SH-3; STRONGARM; XA; SPARCLITE; MIPS; ARM7; ARM9; DRAGONBALL; POWERPC
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    16
  • Package Equivalence Code
    BGA64,10X10,20
  • Clock Frequency-Max (MHz)
    12
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, UNIVERSAL SERIAL BUS
  • Data Transfer Rate-Max (MBps)
    10
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    40

0 suppliers available to buy or to bid for ISP1362EE

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
ISP1362EE
Send an RFQ
ISP1362EE