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ISD4003-06MZI

Winbond Electronics Corporation

Winbond Electronics Corporation ISD4003-06MZI
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    4.7 mm
  • Length
    7.45 mm
  • Technology
    CMOS
  • Application
    HAND-HELD DEVICES
  • JESD-30 Code
    R-PBGA-B19
  • Package Code
    VFBGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    0.75 mm
  • Terminal Finish
    TIN LEAD
  • Consumer IC Type
    SPEECH SYNTHESIZER WITH RCDG
  • Reading Time-Max
    360 s
  • Seated Height-Max
    0.85 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    40 mA
  • Number of Functions
    1
  • Number of Terminals
    19
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA19,4X5,30
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.3 V
  • Supply Voltage-Min (Vsup)
    2.7 V

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ISD4003-06MZI
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ISD4003-06MZI