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ISD1610BSI

Winbond Electronics Corporation

Winbond Electronics Corporation ISD1610BSI
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    3.9
  • Application
    GREETING CARDS; TOYS; ANNUNCIATORS
  • Length (mm)
    9.9
  • JESD-30 Code
    R-PDSO-G16
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Consumer IC Type
    SPEECH SYNTHESIZER WITH RCDG
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    16
  • On Chip Memory Type
    FLASH
  • Terminal Pitch (mm)
    1.27
  • Reading Time-Max (s)
    20
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.75
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.4
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    SOP16,.25
  • Peak Reflow Temperature (Cel)
    240
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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ISD1610BSI