INSSTUA32S868-GS04 by Inphi Corporation. | Sourcengine

Inphi Corporation. INSSTUA32S868-GS04

Lifecycle status
Transferred
RoHS
RoHS compliant
REACH
REACH compliant
Description
Logic Circuit, CMOS, PBGA176
Category
Semiconductors Logic ICs Other Logic ICs LOGIC CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
JESD-30 Code
R-PBGA-B176
Package Code
FBGA
Logic IC Type
LOGIC CIRCUIT
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Number of Terminals
176
Terminal Pitch (mm)
0.635
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Nom (V)
1.8
Package Equivalence Code
BGA176,8X22,25
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
40