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IMP23208P-19

IMP INC

IMP INC IMP23208P-19
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PQCC-J44
  • Memory Width
    8
  • Organization
    256KX8
  • Package Code
    QCCJ
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Memory Density
    2097152 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    190 ns
  • Number of Words
    262144 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    25 mA
  • Number of Terminals
    44
  • Standby Current-Max
    0.0001 Amp
  • Number of Words Code
    256K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    LDCC44,.7SQ
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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IMP23208P-19
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IMP23208P-19