ProductsManufacturers
Events
Send an RFQBOM Tool

IM6654MJG

HARRIS SEMICONDUCTOR

IM6654MJG Datasheet
HARRIS SEMICONDUCTOR IM6654MJG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-CDIP-T24
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    UVPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    512X8
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    600
  • Number of Words Code
    512
  • Memory Density (bits)
    4096
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    512
  • Standby Current-Max (A)
    4.0E-5
  • Supply Current-Max (mA)
    6
  • Package Equivalence Code
    DIP24,.6
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

0 suppliers available to buy or to bid for IM6654MJG

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
IM6654MJG
Send an RFQ
IM6654MJG