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IDT75C58SB30PB

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT75C58SB30PB
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.30
  • SB Code
    8542.39.00.30
  • Technology
    CMOS
  • Width (mm)
    15.24
  • Length (mm)
    36.576
  • JESD-30 Code
    R-PDIP-T28
  • Package Code
    DIP
  • Output Format
    PARALLEL, 8 BITS
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Converter Type
    ADC, FLASH METHOD
  • J-STD-609 Code
    e0
  • Number of Bits
    8
  • Output Bit Code
    BINARY
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Sample Rate (MHz)
    40
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.699
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    DIP28,.6
  • Analog Input Voltage-Max (V)
    0.1
  • Analog Input Voltage-Min (V)
    -1.9
  • Linearity Error-Max (EL) (%)
    0.3
  • Number of Analog In Channels
    1
  • Negative Supply Voltage-Nom (V)
    -5.2
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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IDT75C58SB30PB