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IDT72V811L15TFGI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT72V811L15TFGI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    10 mm
  • Length
    10 mm
  • Cycle Time
    15 ns
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G64
  • Memory Width
    9
  • Organization
    512X9
  • Package Code
    LFQFP
  • JESD-609 Code
    e3
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    4608 bit
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    10 ns
  • Number of Words
    512 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Seated Height-Max
    1.6 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    40 mA
  • Number of Functions
    1
  • Number of Terminals
    64
  • Standby Current-Max
    0.01 Amp
  • Number of Words Code
    512
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    QFP64,.47SQ,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    66.7 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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IDT72V811L15TFGI