Integrated Device Technology, Inc. IDT72T72115L5BB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    19
  • Length (mm)
    19
  • JESD-30 Code
    S-PBGA-B324
  • Memory Width
    72
  • Package Code
    BGA
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS
  • Cycle Time (ns)
    5
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ASYNCHRONOUS OPERATION ALSO POSSIBLE
  • Memory Organization
    128KX72
  • Number of Functions
    1
  • Number of Terminals
    324
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    3.6
  • Number of Words Code
    128K
  • Memory Density (bits)
    9437184
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.97
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    0.05
  • Supply Current-Max (mA)
    60
  • Package Equivalence Code
    BGA324,18X18,40
  • Clock Frequency-Max (MHz)
    200
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for IDT72T72115L5BB

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
IDT72T72115L5BB
Send an RFQ
IDT72T72115L5BB