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IDT72P51777L7-5BBG

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT72P51777L7-5BBG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Cycle Time
    7.5 ns
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B376
  • Memory Width
    40
  • Organization
    256KX40
  • Package Code
    BGA
  • JESD-609 Code
    e3
  • Output Enable
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    10485760 bit
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    3.8 ns
  • Number of Words
    262144 words
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    MATTE TIN
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    200 mA
  • Number of Functions
    1
  • Number of Terminals
    376
  • Standby Current-Max
    0.12 Amp
  • Number of Words Code
    256K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA376,22X22,40
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Clock Frequency-Max (fCLK)
    133 MHz

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IDT72P51777L7-5BBG
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IDT72P51777L7-5BBG