ProductsManufacturers
Events
Send an RFQBOM Tool

IDT7217L55F

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT7217L55F
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    22.86
  • Length (mm)
    22.86
  • JESD-30 Code
    S-CQFP-F64
  • Package Code
    QFF
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED @ 18.18MHZ
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    1.27
  • Output Data Bus Width
    32
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    2.286
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    16
  • Supply Current-Max (mA)
    80
  • Package Equivalence Code
    QFL64,.9SQ
  • Clock Frequency-Max (MHz)
    18.18
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, MULTIPLIER
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for IDT7217L55F

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
IDT7217L55F
Send an RFQ
IDT7217L55F