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IDT71V3576YS150PFG

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT71V3576YS150PFG
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    14 mm
  • Length
    20 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    36
  • Organization
    128KX36
  • Package Code
    LQFP
  • JESD-609 Code
    e3
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    4718592 bit
  • Memory IC Type
    CACHE SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.65 mm
  • Access Time-Max
    3.8 ns
  • Number of Words
    131072 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    MATTE TIN
  • Seated Height-Max
    1.6 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Number of Functions
    1
  • Number of Terminals
    100
  • Number of Words Code
    128K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.465 V
  • Supply Voltage-Min (Vsup)
    3.135 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Moisture Sensitivity Level
    3

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IDT71V3576YS150PFG