ProductsManufacturers
Events
Send an RFQBOM Tool

IDT7187SE

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT7187SE
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    SEPARATE
  • Technology
    CMOS
  • Memory Width
    1
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    64KX1
  • Number of Words Code
    64K
  • Memory Density (bits)
    65536
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    65536
  • Package Equivalence Code
    FL(UNSPEC)
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

0 suppliers available to buy or to bid for IDT7187SE

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
IDT7187SE
Send an RFQ
IDT7187SE