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ICE23M020(32TSOP)

TENX TECHNOLOGY INC

TENX TECHNOLOGY INC ICE23M020(32TSOP)
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G32
  • Memory Width
    8
  • Organization
    256KX8
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    2097152 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    90 ns
  • Number of Words
    262144 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    32
  • Number of Words Code
    256K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    SSOP32,.8,20
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    -20 Cel

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ICE23M020(32TSOP)