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ICE23LM010(32TSOP)

TENX TECHNOLOGY INC

TENX TECHNOLOGY INC ICE23LM010(32TSOP)
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G32
  • Memory Width
    8
  • Organization
    128KX8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    1048576 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    70 ns
  • Number of Words
    131072 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    32
  • Standby Current-Max
    5.0E-6 Amp
  • Number of Words Code
    128K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP32,.8,20
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    -20 Cel

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ICE23LM010(32TSOP)
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ICE23LM010(32TSOP)